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德承DS-1200 無(wú)風(fēng)扇嵌入式工控機(jī)

發(fā)貨地點(diǎn):廣東省深圳市

發(fā)布時(shí)間:2021-06-17

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詳細(xì)信息

  • 型號(hào)DS-1200
  • 貨源類(lèi)別訂貨
  • 設(shè)備類(lèi)型工控電腦
  • 類(lèi)型全新原裝
  • 外形尺寸227 x 261 x 88 mm(mm)
  • OEM可OEM
  • 質(zhì)保一年(年)
  • 重量4.92(KG)
  • 是否支持代理加盟不支持
  • 最快出貨時(shí)間8-15天
  • 售后類(lèi)型全國(guó)聯(lián)保
  • 上市時(shí)間2020
  • 版本DS-1200-R10
  • 包裝清單主機(jī),連接器,適配器
  • 發(fā)票提供發(fā)票
  • 品牌其他

DS-1200

第9/8代Intel® Core™處理器,高性能、擴(kuò)展型和模塊化的強(qiáng)固型嵌入式系統(tǒng)

產(chǎn)品特點(diǎn)

  • 支持第9/8代Intel® Core™ / Pentium® / Celeron® 8 Cores 35W/65W處理器(LGA 1151)

  • 2個(gè)DDR4 SO-DIMM內(nèi)存插槽,最高支持 2666MHz 64GB

  • 三重獨(dú)立顯示:1個(gè) DVI-I 和2個(gè) DP(4K 分辨率)

  • 1個(gè)M.2 2280 M Key插槽,自動(dòng)檢測(cè)PCIex4 NVMe SSD 或 SATA Gen3 SSD

  • 2個(gè)前面板可抽取式SIM卡插槽,用于信號(hào)冗余

  • 4個(gè)可用于I/O擴(kuò)展的CMI插槽

  • 1個(gè)CFM插槽,可擴(kuò)展智能點(diǎn)火控制功能

  • 寬工作溫度 -40°C 至 70°C

  • EN50155 (EN50121-3-2) / EN60950-1

  • 產(chǎn)品介紹

  • 德承DS-1200是一款高性能的無(wú)風(fēng)扇嵌入式計(jì)算機(jī),采用第9/8代Intel®Core™平臺(tái)(Coffee Lake-R/S),提供多達(dá)6個(gè)核心來(lái)滿足各種高端計(jì)算需求。DS-1200提供豐富的I/O,如1個(gè)PS/2、1個(gè)音頻輸入輸出、2個(gè)RS-232/422/485串口、2個(gè)Intel®GbE網(wǎng)口、2個(gè)USB 3.1 (Gen2)、4個(gè)USB 3.0、2個(gè)USB 2.0并具備三重獨(dú)立顯示。在內(nèi)存和存儲(chǔ)方面,DS-1200可配備多達(dá)32GB的DDR4-2666 SO-DIMM內(nèi)存,2個(gè)2.5寸SATA III硬盤(pán),3個(gè)mSATA SSD和1個(gè)M.2 2280 NVMe SSD,滿足高性能存儲(chǔ)需求。

    基于德承獨(dú)特的CMI和CFM技術(shù),用戶可使用各種現(xiàn)成的模塊根據(jù)自己的具體需求來(lái)配置系統(tǒng)。DS-1200是一款堅(jiān)固耐用的嵌入式系統(tǒng),具有寬工作溫度(-40°C ~ 70°C),寬壓直流電源輸入(9V ~ 48V),抗沖擊和振動(dòng)能力強(qiáng),高標(biāo)準(zhǔn)的工業(yè)保護(hù),具有超級(jí)電容可免維護(hù)長(zhǎng)效運(yùn)行等特點(diǎn)。該系統(tǒng)適用于工廠自動(dòng)化、機(jī)器視覺(jué)、車(chē)載計(jì)算和移動(dòng)等惡劣環(huán)境下的高端應(yīng)用。

  • 詳細(xì)規(guī)格

  • Model NameDS-1200
    SystemProcessor• 9th Generation Intel® Coffee Lake-R S Series CPU:
     - Intel® Core™ i7-9700E 8 Cores Up to 4.4 GHz, TDP 65W
     - Intel® Core™ i5-9500E 6 Cores Up to 4.2 GHz, TDP 65W
     - Intel® Core™ i3-9100E 4 Cores Up to 3.7 GHz, TDP 65W
     - Intel® Core™ i7-9700TE 8 Cores Up to 3.8 GHz, TDP 35W
     - Intel® Core™ i5-9500TE 6 Cores Up to 3.6 GHz, TDP 35W
     - Intel® Core™ i3-9100TE 4 Cores Up to 3.2 GHz, TDP 35W
    • 8th Generation Intel® Coffee Lake S Series CPU:
     - Intel® Core™ i7-8700 6 Cores Up to 4.6 GHz - 12M Cache, TDP 65W
     - Intel® Core™ i5-8500 6 Cores Up to 4.1 GHz - 9M Cache, TDP 65W
     - Intel® Core™ i3-8100 4 Cores 3.6 GHz - 6M Cache, TDP 65W
     - Intel® Core™ i7-8700T 6 Cores Up to 4.0 GHz - 12M Cache, TDP 35W
     - Intel® Core™ i5-8500T 6 Cores Up to 3.5 GHz - 9M Cache, TDP 35W
     - Intel® Core™ i3-8100T 4 Cores 3.1 GHz - 6M Cache, TDP 35W
     - Intel® Pentium® G5400 2 Cores 3.7 GHz - 4M Cache, TDP 58W
     - Intel® Pentium® G5400T 2 Cores 3.1 GHz - 4M Cache, TDP 35W
     - Intel® Celeron® G4900 2 Cores 3.1 GHz - 2M Cache, TDP 54W
     - Intel® Celeron® G4900T 2 Cores 2.9 GHz - 2M Cache, TDP 35W
    ChipsetIntel Q370
    Memory2x DDR4-2400/2666 MHz SO-DIMM Sockets, Supports up to 64 GB (Un-buffered and Non-ECC Type)
    Graphics• Integrated Intel® UHD Graphics 630: Core™ i7/i5/i3
    • Integrated Intel® UHD Graphics 610: Pentium® /Celeron®
    • Supports Triple Independent Display (1x DVI-I, 2x DisplayPort)
    AudioRealtek® ALC888, High Definition Audio
    BIOSAMI 32MB SPI BIOS
    I/O InterfaceDVI1x DVI-I (DVI-D: 1920 x 1200 @60Hz / VGA: 1920 x 1080 @60Hz)
    DP2x DisplayPort (DisplayPort: 4096 x 2304 @60Hz)
    LAN2x GbE LAN (Supports WoL, Teaming, Jumbo Frame & PXE), RJ45
       - GbE1: Intel® I210-IT
       - GbE2: Intel® I219-LM
    Optional CMI Module
       - 4x RJ45 GbE LAN Module 
       - 4x M12 GbE LAN Module 
    PoE+Optional CMI & CFM Module
       - 4x PoE+, Individual port 25.5W, RJ45 Port
       - 4x PoE+, Individual port 25.5W, M12 Port
    Serial Port2x RS-232/422/485, DB9
    Optional CMI Module
       - 4x Isolated COM Module 
       - 4x COM Module
          * Supports RS-232/422/485 with Auto Flow Control, 5V/12V, DB9
    USB2x USB 3.1 Gen2 (Type A)
    4x USB 3.0 (Type A)
    2x USB 2.0 (Type A)
    PS/2 Port1x PS/2, 6-pin mini-DIN Female Connector
    Isolated DIOOptional CMI Module
       - 16x Optical Isolated DIO Module (8 in/8 out)
    Line-Out1x Line-Out, Phone Jack 3.5mm
    Mic-In1x Mic-In, Phone Jack 3.5mm
    Power Button1x ATX Power On/Off Button
    AT/ATX Switch1x AT/ATX Mode Switch
    Clear CMOS Switch1x Clear CMOS Switch
    Remote Power On/Off Connector1x Remote Power On/Off Connector, 2-pin Terminal Block
    Remote Reset Connector1x Remote Reset Connector, 2-pin Terminal Block
    External FAN Connector1x External FAN Connector, 4-pin Terminal Block
    StorageSSD/HDD• 2x 2.5" SATA HDD/SSD bay (Gen3), 1x Internal, 1x Front Accessable
    • Supports RAID 0/1
    M.21x M.2 Key M 2280 Socket, Supports PCIe x4 NVMe SSD or SATA SSD (Gen3)
    mSATA3x mSATA (shared by Mini-PCIe socket) (Gen3), BIOS Selectable
    ExpansionCFM (Control Function Module) Interface1x CFM (Control Function Module) Interface
    CMI (Combined Multiple I/O) Interface2x CMI (Combined Multiple I/O) High Speed Interface
    2x CMI (Combined Multiple I/O) Low Speed Interface
    Mini PCI Express
    3x Full-size Mini-PCIe Socket
    Universal I/O Bracket4x Universal I/O Bracket
    SIM Socket2x SIM Socket
    Antenna Holes2x Antenna Holes
    OtherInstant RebootSupport 0.2sec
    Super CapSuperCap Integrated for CMOS Battery Maintenance-free Operation
    Watchdog TimerSoftware Programmable Supports 256 Levels System Reset
    Power RequirementPower TypeAT/ATX
    Power Input Voltage9~48VDC
    Connector3-pin Terminal Block
    Power AdapterOptional AC/DC Adapter
      - AC/DC 24V/5A, 120W
      - AC/DC 24V/9.2A, 220W
    PhysicalDimension (WxDxH)227 x 261 x 88 mm
    Weight Information4.92 kg
    Mechanical ConstructionExtruded Aluminum with Heavy Duty Metal
    MountingWall
    Unibody DesignYes
    Fanless DesignYes
    Jumper-less DesignYes
    ProtectionReverse Power Input ProtectionYes
    Over Voltage ProtectionProtection Range: 51~58V
    Protection Type: shut down operating voltage, re-power on at the preset level to recover
    Over Current Protection15A
    ESD Protection+/-8kV (air), +/-4kV (contact)
    Surge3.84 kV (impedance 12 ohm 1.2/50us waveform)
    Operating SystemWindowsWindows® 10
    LinuxSupports by project
    EnvironmentOperating Temperature• 35W TDP Processor: -40°C to 70°C
    • 51~65W TDP Processor: -40°C to 45°C
     * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
     * With extended temperature peripherals; Ambient with air flow
     * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
    Storage Temperature-40°C to 85°C
    Relative Humidity95%RH @ 70°C (non-Condensing)
    ShockOperating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
    VibrationOperating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)
    MTBF396,565 Hours
    CertificationEMCCE,  FCC Class A
    SafetyLVD (EN60950-1)
    RailwayEN50155, EN50121-3-2
  • 訂購(gòu)信息

  • Available Models

  • Model No.Product Desction
    DS-1200-R109/8th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer


 

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